Electronics Packaging Forum - Multichip Module Technology Issues

James E. Morris (Editor)

ISBN 10: 078030439X / ISBN 13: 9780780304390

Verlag: IEEE Press, Piscataway, NJ, 1993

Beschreibung

Hard pictorial covers, an as new copy, pp vii,392. Text figures and tables throughout. Size: 16x24cm.

Bestandsnummer des Verkäufers 005145

Bibliografische Details

• Titel: Electronics Packaging Forum - Multichip Module Technology Issues
• Verlag: IEEE Press, Piscataway, NJ
• Erscheinungsjahr: 1993
• Sprache: Englisch
• ISBN-10: 078030439X
• ISBN-13: 9780780304390
• Einband: Hard Cover
• Auflage: First Edition.
• Verkäuferkataloge:
  • COMPUTERS & IT
  • ELECTRICAL ENGINEERING
  • CHEMISTRY

Über diesen Titel

Inhaltsangabe

Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes; how to use the finite-difference time-domain approach in electromagnetic modeling; and the development of dedicated test chips for package evaluation in varied field conditions. Annotation copyright Book News, Inc. Portland, Or.

Reseña del editor

Keep up with the leading-edge technology with this practical volume, which brings a multidisciplinary treatment to the field of electronic packaging and multichip modules. The most comprehensive resource on packaging now, the volume uses real-world examples to focus on the multichip module's important and still emerging role. Important topics covered include building long-term reliability by increasing polyimide stability, recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes, circuit and electromagnetic solutions to problems of modeling highspeed electrical interconnections, how to use the finite-difference time-domain approach in electromagnetic modeling, and the development of dedicated test chips for package evaluation in varied field conditions. Electronics Packaging Forum is a key source of information on technology and techniques for businesses involved in packaging today.