Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, Band 494) - Softcover

Buch 195 von 260: The Springer International Series in Engineering and Computer Science
 
9781461372318: Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, Band 494)
Softcover
ISBN 10: 1461372313 ISBN 13: 9781461372318
Verlag: Springer, 2012

Inhaltsangabe

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

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Verlag
Springer
Erscheinungsdatum
2012
Sprache
Englisch
ISBN 10 
1461372313
ISBN 13 
9781461372318
Einband
Taschenbuch
Anzahl der Seiten
272
Herausgeber
Wagner Lawrence C.
Kontakt zum Hersteller
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Weitere beliebte Ausgaben desselben Titels

9780412145612: Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494, Band 494)

Vorgestellte Ausgabe

ISBN 10:  0412145618 ISBN 13:  9780412145612
Verlag: Springer, 1999
Hardcover