F roozeboom (15 Ergebnisse)
- Softcover
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- Softcover
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at t…he graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
- Hardcover
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the grad…uate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
- Hardcover
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EUR 517,38
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Zustand: New. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Editor(s): Roozeboom, Fred. Series: NATO Science Series E. Num Pages: 578 pages, biography. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 2…35 x 155 x 31. Weight in Grams: 989. . 1996. Hardback. . . . .
- Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USAKennys Bookstore
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EUR 650,09
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Zustand: New. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Editor(s): Roozeboom, Fred. Series: NATO Science Series E. Num Pages: 578 pages, biography. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 2…35 x 155 x 31. Weight in Grams: 989. . 1996. Hardback. . . . . Books ship from the US and Ireland.
- Softcover
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Paperback. Zustand: Brand New. 584 pages. 9.00x6.25x1.31 inches. In Stock.
- Softcover
- Print-on-Demand
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Zustand: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
- Hardcover
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Zustand: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
- Softcover
- Print-on-Demand
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EUR 355,65
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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electr…ical engineering, applied p.
- Hardcover
- Print-on-Demand
Anbieter: moluna, Greven, Deutschlandmoluna
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Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturi…ng, electrical engineering, applied p.
- Softcover
- Print-on-Demand
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, DeutschlandBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology ar…e discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage. 580 pp. Englisch.
- Hardcover
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Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, DeutschlandBuchWeltWeit Ludwig Meier e.K.
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EUR 427,99
EUR 23,00 VersandVersand von Deutschland nach USAAnzahl: 2 verfügbar
Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discu…ssed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage. 582 pp. Englisch.
Sprache: Englisch
Verlag: Springer Netherlands, Springer Netherlands Dez 2010, 2010
- Softcover
- Print-on-Demand
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschlandbuchversandmimpf2000
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Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are di…scussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 580 pp. Englisch.
Sprache: Englisch
Verlag: Springer Netherlands, Springer Netherlands Mär 1996, 1996
- Hardcover
- Print-on-Demand
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschlandbuchversandmimpf2000
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 427,99
EUR 60,00 VersandVersand von Deutschland nach USAAnzahl: 1 verfügbar
Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed… at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 582 pp. Englisch.
