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Verkäuferbewertung
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Hardcover. Zustand: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority!
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hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Microelectronic Packaging Handbook
Verlag: Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Sprache: Englisch
Anbieter: Better World Books, Mishawaka, IN, USA
Verkäuferbewertung 5 von 5 Sternen
Erstausgabe
Zustand: Good. 1st Edition. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.
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Microelectronic Packaging Handbook
Verlag: Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Sprache: Englisch
Anbieter: Better World Books, Mishawaka, IN, USA
Verkäuferbewertung 5 von 5 Sternen
Erstausgabe
Zustand: Good. 1st Edition. Used book that is in clean, average condition without any missing pages.
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Microelectronic Packaging Handbook
Verlag: Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Sprache: Englisch
Anbieter: Better World Books, Mishawaka, IN, USA
Verkäuferbewertung 5 von 5 Sternen
Erstausgabe
Zustand: Very Good. 1st Edition. Used book that is in excellent condition. May show signs of wear or have minor defects.
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Microelectronics Packaging Handbook
Anbieter: ThriftBooks-Dallas, Dallas, TX, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Microelectronics Packaging Handbook
Anbieter: ThriftBooks-Atlanta, AUSTELL, GA, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Microelectronics Packaging Handbook
Anbieter: ThriftBooks-Dallas, Dallas, TX, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Microelectronics Packaging Handbook
Anbieter: Wonder Book, Frederick, MD, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: Good. Good condition. Good dust jacket. A copy that has been read but remains intact. May contain markings such as bookplates, stamps, limited notes and highlighting, or a few light stains. NOT AVAILABLE FOR SHIPMENT OUTSIDE OF THE UNITED STATES.
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Fundamentals of Engineering: Discipline-Specific Fe/Eit Exam Review
Anbieter: ThriftBooks-Atlanta, AUSTELL, GA, USA
Verkäuferbewertung 5 von 5 Sternen
Paperback. Zustand: Very Good. No Jacket. Former library book; May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 0.35.
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Zustand: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
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Microelectronics Packaging Handbook
Anbieter: A Squared Books (Don Dewhirst), South Lyon, MI, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book.
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hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Anbieter: ThriftBooks-Atlanta, AUSTELL, GA, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Anbieter: The Maryland Book Bank, Baltimore, MD, USA
Verkäuferbewertung 4 von 5 Sternen
hardcover. Zustand: Very Good. 2nd. Used - Very Good.
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hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Microelectronics Packaging Handbook
Verlag: Kluwer Academic Publishers, 1988
ISBN 10: 0442205783 ISBN 13: 9780442205782
Sprache: Englisch
Anbieter: WeBuyBooks, Rossendale, LANCS, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
EUR 21,36
EUR 14,32 shipping
Ships from Vereinigtes Königreich to USAAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to the page edges/pages . Previous owners name inside the front page/cover.
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Sources and Expressions of Resiliency in Trauma Survivors
Anbieter: ThriftBooks-Atlanta, AUSTELL, GA, USA
Verkäuferbewertung 5 von 5 Sternen
Paperback. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Sources and Expressions of Resiliency in Trauma Survivors
Anbieter: Goodwill Industries of VSB, Oxnard, CA, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: Acceptable. The book is 100% readable but visibly worn, and damaged. This may include stains. tears, rips, folded pages, binding damage, dents, scuffs, scratches and sticker residue. The book also may contain heavy highlighting and notes. Most books listed do not fall under these conditions as we tend to underlist. If you would like a photo of your purchase,please contact us.
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
EUR 32,62
EUR 15,34 shipping
Ships from Vereinigtes Königreich to USAAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515.
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Microelectronics Packaging Handbook: Subsystem Packaging (Volume 3)
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
EUR 33,01
EUR 15,34 shipping
Ships from Vereinigtes Königreich to USAAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. Volume 3. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780412084515.
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Microelectronics Packaging HandBook
Verlag: Van Nostrand Reinhold, New York NY, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Sprache: Englisch
Anbieter: Longs Peak Book Company, Loveland, CO, USA
Verkäuferbewertung 4 von 5 Sternen
Erstausgabe
Hardcover. Zustand: Near Fine. 1st Edition. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. This copy is in excellent condition, a second printing of the first edition, a hardback with no dustjacket . Given the book's size and weight--3# 13oz-- shipping charges will be adjusted.The book will be carefully wrapped and boxed for safe shipping.
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Microelectronics Packaging Handbook: Semiconductor Packaging (Volume 2)
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
EUR 33,03
EUR 18,20 shipping
Ships from Vereinigtes Königreich to USAAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. Volume 2. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1650grams, ISBN:9780412084416.
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Microelectronics Packaging Handbook
Anbieter: BookDepart, Shepherdstown, WV, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: UsedVeryGood. Hardcover; light fading, light shelf wear to exterior; otherwise in very good condition with clean text, firm binding. Dust jacket, light fading, light shelf wear.
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Microelectronics Packaging Handbook Vol. 2 : Semiconductor Packaging
Anbieter: Better World Books: West, Reno, NV, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: Good. Used book that is in clean, average condition without any missing pages.
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Sources and Expressions of Resiliency in Trauma Survivors : Ecological Theory, Multicultural Practice
Anbieter: GreatBookPrices, Columbia, MD, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: As New. Unread book in perfect condition.
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Hardcover. Zustand: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks.
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Sources and Expressions of Resiliency in Trauma Survivors : Ecological Theory, Multicultural Practice
Anbieter: GreatBookPrices, Columbia, MD, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: New.
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