Microelectronics Packaging Handbook - Hardcover

Tummala, R.R.

Hardcover

ISBN 10: 0442205783 ISBN 13: 9780442205782

Verlag: Springer, 1988

Inhaltsangabe

RALPH E. GOMORY IBM SENIOR VICE-PRESIDENT, SCIENCE AND TECHNOLOGY Far from being passive containers for microelectronic devices, the so-called "packages" in today's advanced computers pose at least as many engineering challenges as the chips that they interconnect, power, and cool. New pack­ aging concepts often lead their developers into uncharted areas of science. Ultimately, progress in packaging is likely to set the limits on how far computers can evolve. And yet, this technology has never captured the public imagination in the way that chips have. Worse, it has been largely overlooked by universities as a prime subject for teaching and research. In part, this academic oversight stems from packaging's multidiscipli­ nary nature. Packaging involves the solution of electrical, mechanical, and thermal problems; it requires understanding at the molecular level not only of silicon but of metals, ceramics, polymers, glass, and composites. In short, iii iv FOREWORD it is poorly matched to the traditional separation of university disciplines. Another roadblock has been the lack of a comprehensive book dealing ade­ quately with state of the art packaging design and modern industry require­ ments.

Details zur Ausgabe

• Verlag: Springer
• Erscheinungsdatum: 1988
• Sprache: Englisch
• ISBN 10: 0442205783
• ISBN 13: 9780442205782
• Einband: Gebundene Ausgabe
• Auflage: 1
• Anzahl der Seiten: 1194
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Deutschland