ISBN: 9781119045939 - sip system-in-package design and simulation: mentor ee flow advanced design guide (18 Ergebnisse)

Zustand: New.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: New. An advanced reference documenting, in detail, every step of a real System in Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor Graphics Expedition Enterprise Flow. Num Pages: 400 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 220 x 154 x 23. Weight in Grams: 666. . 2017. Hardback. . . . .…

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Hardback. Zustand: New. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.  Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:   Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.…

Gebunden. Zustand: New. Mr. Suny Li (Li Yang) is a SiP/PCB Technical Specialist in China he now works in AcconSys Technology Co. Ltd, (a Mentor Authorized Distributor for China). Suny has guided and consulted on dozens of SiP projects in China, accumulating plentiful experience i.

Zustand: New. An advanced reference documenting, in detail, every step of a real System in Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor Graphics Expedition Enterprise Flow. Num Pages: 400 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 220 x 154 x 23. Weight in Grams: 666. . 2017. Hardback. . . . . Books ship from the US and Ireland.…

Hardcover. Zustand: Brand New. 400 pages. 8.66x6.08x0.88 inches. In Stock.

Buch. Zustand: Neu. Neuware - An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flowWritten by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:\* Cavity and sacked dies design\* FlipChip and RDL design\* Routing and coppering\* 3D Real-Time DRC check\* SiP simulation technology\* Mentor SiP Design and Simulation PlatformDesigned to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.…

Hardback. Zustand: New. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.  Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:   Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.…

Hardcover. Zustand: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

HRD. Zustand: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Hardback. Zustand: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.

Hardcover. Zustand: new. Hardcover. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Zustand: New. Print on Demand.

Zustand: New. PRINT ON DEMAND.