Microelectronic packaging technology materials (5 Ergebnisse)
- Hardcover
Anbieter: HPB-Diamond, Dallas, TX, USAHPB-Diamond
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Gebraucht - Gut
EUR 38,03
EUR 3,24 VersandVersand innerhalb von USAAnzahl: 1 verfügbar
hardcover. Zustand: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.
- Hardcover
Anbieter: liu xing, Nanjing, JS, Chinaliu xing
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 443,55
EUR 15,55 VersandVersand von China nach USAAnzahl: 1 verfügbar
Hardcover. Zustand: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protectio…n) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .
- Hardcover
Anbieter: liu xing, Nanjing, JS, Chinaliu xing
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 443,55
EUR 15,55 VersandVersand von China nach USAAnzahl: 3 verfügbar
Hardcover. Zustand: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protectio…n) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .
- Softcover
Anbieter: liu xing, Nanjing, JS, Chinaliu xing
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 46,79
EUR 15,55 VersandVersand von China nach USAAnzahl: 1 verfügbar
paperback. Zustand: New. Paperback. Pub Date: 2011 08 Pages: 137 Language: Chinese Publisher: Higher Education Press Vocational electronics manufacturing class professional planning materials: microelectronic packaging technology entire body of knowledge in microelectronic packaging technology is divided into two parts. Chapter…12. The first part of the process. and the second part is a typical package. Include the introduction. wafer dicing. die attach. chip interconnect. molding. other process. dual in-line package.
- Softcover
Anbieter: liu xing, Nanjing, JS, Chinaliu xing
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 65,40
EUR 15,55 VersandVersand von China nach USAAnzahl: 3 verfügbar
paperback. Zustand: New. Language:Chinese.Microelectronic packaging technology higher education second five planning materials and electronic materials and application technology planning materials series.
