Electrical design silicon (18 Ergebnisse)

Zustand: Very Good. : Este libro aborda el diseño eléctrico de Through Silicon Via (TSV), un componente esencial en la integración 3D de circuitos electrónicos. Explora las características y desafíos del diseño, ofreciendo información valiosa para ingenieros y estudiantes en el campo de la ingeniería electrónica y el diseño de circuitos. EAN: 9789401790376 Tipo: Libros Categoría: Tecnología Título: Electrical Design of Through Silicon Via Autor: Manho Lee| Jun So Pak| Joungho Kim Idioma: eng Páginas: 280 Formato: Tapa dura Año de publicación: 2014.…

Zustand: New. In English.

Zustand: New. pp. 292.

Hardcover. Zustand: Brand New. 2014 edition. 390 pages. 9.50x6.50x1.00 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.…

Hardcover. Zustand: gut. 2014. Electrical Design of Through Silicon Via In deutscher Sprache. pages.

Paperback. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered. 292 pp. Englisch.…

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides fundamental modeling of TSV which is a very essential part of 3D ICsIncludes both numerical formula analysis and qualitative explanationsApproach from various view points: signal integrity, power integrity and etc.H.…

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides fundamental modeling of TSV which is a very essential part of 3D ICsIncludes both numerical formula analysis and qualitative explanationsApproach from various view points: signal integrity, power integrity and etc.H.…

PAP. Zustand: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Zustand: New. Print on Demand pp. 292 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Zustand: New. PRINT ON DEMAND pp. 292.

Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep intoTSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 292 pp. Englisch.…

Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep intoTSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 292 pp. Englisch.…

Taschenbuch. Zustand: Neu. Vic Kulkarni | Electronic Design Automation, Silicon Valley, National Semiconductor, Electrical Engineering | Lambert M. Surhone (u. a.) | Taschenbuch | Englisch | 2026 | OmniScriptum | EAN 9786133211711 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand. …

Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Please note that the content of this book primarily consists of articlesavailable from Wikipedia or other free sources online. Vic Kulkarni isGeneral Manager and Senior Vice President of the RTL Business Unit ofApache Design Solutions, a leading EDA Electronic Design Automationcompany. Apache acquired Sequence Design in 2009. Vic had served asSequence's President and CEO since 2002. Among his many professionalaccolades, Vic was named 'Entrepreneur of the Month' by SiliconIndiamagazine and secured Sequence a spot in the prestigious Reed Electronics'50 Electronics Companies to Watch.' He is a regular contributor ofopinion pieces to leading industry magazines, and is a frequent panelistat industry events.…